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Fabien DURIX

En résumé

Mes compétences :
ingenieur Process

Entreprises

  • Ebara Precision Machinery Europe - Business Development Manager

    2010 - maintenant I am working in Semiconductor Industry specialized in Chemichal Meachanical Polishing.

    EBARA Precision Machinery Europe was founded in 1994 as subsidiary of the Japanese EBARA Corporation for the field of Semiconductors. With 130 employees, EBARA Precision Machinery Europe is engaged in sales and service of its key products vacuum pumps, abatement, CMP and Plating and provides application and the engineering. It also can realize larger Projects in the Semiconductor and Solar industry. EBARA's strengths are proximity to the customer, fast responsiveness, complete Service coverage and its full commitment to quality and customer satisfaction. Ebara Corporation is working as a technology leader more than 24 years in the field of CMP and is experienced in polishing 20 nm below technology node wafers. EBARAs tool, polishing head and endpoint detection technology is designed for advanced technology nodes. The unique design also allows a cross contamination free running of FEOL and Beol processes. EBARA Precision Machinery Europe WOULD contribute by developing the necessary CMP steps and processes for FEOL, MOL and BEOL.

    I am working as Account Manager and taking care of :
    - 30% of my responsability is to look for new Partners to promote new solutions to our customer in Europe.
    - Attending on European and International conference and exhibition in Semiconductor industry.
    - 20% of my Job is to take care of European program between Japan and Europe.
    - 25% of my Job is to take care of France customer.
    - And other 25% of my job is to take care of Iatlian.
  • Ebara Precision Machinery Europe - Process Development Engineer

    2006 - 2011 Process development for European customer.
    - Site Manager in Leti at CEA Grenoble.
    - R&D CMP Process Engineer on Ebara 300mm tool including Front end of line and Back end of line process for 65, 45, 40 and 28nm and beyond technology node.
    - Characterization of pattern wafer in STI, W, Oxide, Cu and Barrier Metal process.
    - Benchmarking of CMP slurries such as DoW, Cabot, Hitachi, Fujimi, JSR, BASF, Showa Denko, AGC, Air liquide and DaNM.
    - Benchmarking of consumables such as Pad, conditioners and sponges with Cabot, Nexplanar, Semiquest, 3M, Entegris and Ishizuka Material.
    - Promoted all new development/product from the company to the customer.
    - Performing some DOE (Design of Experimentation).
    - Troubleshooting on CMP process issue.
    - Reporting the activities and development to the management.
    - Process CMP training performed on customer site.

    - Maintenance Engineer on 300mm tool and taking care of preventive maintenance.

Formations

Pas de formation renseignée

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