GRENOBLE
Engineer diploma : 2009 - Grenoble-INP - Material science.
PhD @ STMicroelectronics-Crolles (since november 2009)
Work on : innovative interconnections (Through Silicon Via or TSV) for advanced IC stacking (3D integration and Wafer Level Packaging)
Skills :
- Material science
- Microelectronic process (Back-end of the line and photolithography)
- Finite Element Modeling (Ansys)
- Reliability
Mes compétences :
Physique du solide
Physique du semi conducteur
Simulations numériques
Microélectronique
