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Aydine MODJTAHEDI

TALENCE

En résumé

Competencies:

Compact models:
Test Structures, SPICE, BSIM3V3, PSP103.1, JUNCAP, HiCuM, Mismatch, corners, PCM analysis, 1/f noise model, parameter extractions, Design Rule Manual

Electrical Devices characterization (DC, CV, 1/f):
CMOS, CMOS SOI PD, DMOS, BJT, SiGe HBT, Diodes, Resistors, MIM Capacitances, Vias, metallization

Device Reliability:
Hot Carrier Injection, TDDB, NBTI, Electromigration, HTGS, HTRB, Statistical distributions, JEDEC standards, AEC-Q100 Automotive standards, fab to fab transfer

Project Management:
From 70 to 300 K€: Involved in various Industrial Projects
From 60 K€ to 15 M€: Involved in National and European Collaborative Research programs(ANR, FP7)

Marketing& customer management:
SME entrepreneurship, Semiconductor market analysis, Business development, Exhibition, International exposure, NDA, Quotation, Contract reviewing, Negotiation

Mes compétences :
ASIC
Characterization
CMOS
Microelectronics
Physics
reliability
Semiconductor
Semiconductors
SPICE
VLSI

Entreprises

  • XMOD Technologies - Senior Characterization & Modeling Engineer , TMM

    2004 - maintenant • Engineering: Semiconductor Device characterization, SPICE modeling & Device reliability investigation :
    • Project management :
    • Marketing & associated tasks :

  • On semiconductor - Device reliability Engineer

    TOULOUSE 2000 - 2004 • Responsible of reliability and qualification of high voltage smart power technologies, internally (I2T & I3T family based on BCD 0.35 um technology) and externally (TSMC-Hsin Shu/Taiwan) in the technology transfer frame.

    • Reliability Requirement File supports

    • Failure mechanism identification and reliability tests performing on DMOS/VDMOS, BJT and DIODES: Hot carrier injections and mobile ions contaminations.

    • Technical support for robust DMOS/VDMOS device development (R&D), design support for optimized usage of DMOS/VDMOS

    • Involved in several European Research projects: AUTOMACS, RADANA & COMPOSE. Partners: IMEC, EPFL, BOSCH, Silvaco

  • Schneider electric - Purchasing assitant-mission

    Rueil Malmaison 1999 - 1999 • Supplier panel rationalization : 10 M€, electronics components portfolio
    • Guidelines and support to the Lead Purchaser for Electronic Component strategy – 5 years prospective
    • Creation and coordination of an obsolescence committee for microelectronics devices including 4 production sites (EDM/DHM) in order to face shortages in electronic component market.

  • IMS lab- University of Bordeaux- France - Reaserch assitant (PhD program)

    1996 - 1998 • Characterization of the reliability performances (resistance to electromigration phenomenon) of interconnections and metallization (Al, Al/Cu, Cu) in VLSI –ULSI integrated circuits

    • On wafer low frequency noise measurements for statistical and non destructive investigation of interconnection reliability performances.

Formations

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