LANGENFELD
I am the Application Engineer and Application Center Manager for Alpha in Europe, a material supplier for the electronics industries (power module, LED, RF, power discrete, etc.). In this role, I lead the company customer trials in Europe, overseeing the development of specific die-attach processes for customers and providing technical and application support on mass-production equipment to our customers. Our silver based die-attach products offer high quality performances and enhance the reliability of electronic packages. Our latest exciting work to date was the launch during the PCIM show 2015 in Nuremberg of Argomax® preform product line for ultra-high reliability applications and large area attachment.
Before, I joined Alpha, I worked for IMS laboratory (Bordeaux, France) and Microsemi Corporation (Bordeaux, France) as a R&D engineer. I was part of teams working on electronic packaging solutions for automotive and aeronautics segments. I was lucky to join two R&D projects during the few months I spend in both India and South Africa.
I enjoy every parts of my work and always interested to connect with fellow engineers. Working alongside with our customers and our team to help the customer achieve their goals and growth is the favorite part of my daily work. As we go through extensive exchange and collaboration to challenge each other to find the most suitable solution for our customers.
I have a PhD in electronics from the University of Bordeaux and a Master of Engineering in Materials Science from the Ecole Nationale Superieure d’Ingenieurs de Limoges.
I am always interested in hearing from former colleague, engineers, or just interesting and challenging people, so feel to contact me if you would like to connect.
Mes compétences :
Electronique
Packaging
Sintering
Soldering
Continuous Improvement
R&D
Six Sigma
Failure analysis
Process Engineering
Material Science
Manufacturing
Semiconductors
Microelectronics
Power module
Electronics Packaging
Reliability Engineering
