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Halil KURT

Rueil Malmaison

En résumé

Dear Madame or Sir,

A motivated and highly organized individual, junior R&D engineer. Understanding of design methodologies and design, having worked in busy analog / digital CAD development, simulation environments and layouts. Having worked in different steps of processing microelectronics in clean room. The use of technological tools (software CAD, PCB, characterization...), the development of process technology, which is significant in microelectronics.

Respectfully yours,

Halil KURT

Mes compétences :
Conception ASICs Mixtes Analogiques - Numériques
Conception carte électronique
Conception
Process
Microélectronique
Cadence

Entreprises

  • Schneider Electric - Electronic Project Manager

    Rueil Malmaison 2018 - maintenant 1st Project Firmware update for the product range Compact NSX100 ... 630 3-pole Micrologic 5/6 E

    2d Project Productivity project: In order to reduce the cost-savings of Micrologic's Compact NSX Trip Units range.

    ▪ Responds to call for tenders
    ▪ Participates in technical choices (architecture, components, reviews) as well as design phases
    ▪ Guarantees Costs, Quality, Timeframe commitments of the project he deals with
    ▪ Plans and tracks the progress of the electronic part
    ▪ Coordinates and supports the technical team
    ▪ Ensures relationships with customer and supplier technical teams
    ▪ Reports to his technical director and business manager
  • Thales - Test and Validation Engineer

    Courbevoie 2018 - 2018 In the context of the development of a sequencer of power supplies equipping a new aircraft, the physical verification of the performances and the respect of the specification of the PLD are obligatory. This part of the system is classified at the highest level of criticality according to aeronautical standard DO254 (DAL A). The PLD consists of a state machine, several SPI links (internal and external) internal register. There were about 250 requirements to test.

    Physical Verification:
    ▪ Implementation of detailed test procedures
    ▪ Measurements on card with adequate metrology (Oscilloscope with digital probe)
    ▪ Automatic bench measurements (results used with NI Digital Waveform Editor)
    ▪ Peer reviews of procedures written by my colleague also working in physical verification
    ▪ Using SVN for Tracking Versions and Peer Reviews
    ▪ Using different serial links (SPI, I2C)
    ▪ Creation / modification of various documents used for certification and audit of PLD
    ▪ Feedback of information if errors identified in the specification
  • NETAŞ - Hardware Design Engineer

    2014 - 2018 04/2017 – 01/2018
    Sr. Electronic Hardware Design Engineer - Defence Product Solutions Department
    NORTEL NETWORKS – NETAS TELECOMMUNICATIONS – ISTANBUL, TURKEY

    SHDSL VoIP Desktop Phone: Technology Transfer to Algeria
    ▪ Preparation to mass production (Recycle PCB – PCBA - Mechanical)
    ▪ EMC & EMI - Environmental Test (Temperature, Humidity, Vibration.)
    ▪ Modelling / Mechanical design 2D / 3D using CATIA V5
    ▪ Team Lead (Algeria)


    12/2014 – 04/2017
    Hardware Design Engineer - Defence Product Solutions Department
    NORTEL NETWORKS – NETAS TELECOMMUNICATIONS – ISTANBUL, TURKEY

    Prototype SHDSL IP Desktop Phone: Technology Transfer to Algeria
    ▪ System, Schematic and High-Speed PCB Design
    ▪ Lay-out Design (16-Layer PCB)
    ▪ Ethernet, SHDSL, I2C, I2S interface
    ▪ Lead Engineer Role
    ▪ Test PCB, Test prototype
    ▪ The intellectual properties
    ▪ Preparation to mass production
  • Digicom Telecom - Technical IT & Operation

    2013 - 2014 ▪ Providing telephone and remote assistance to customers
    ▪ Attending customer sites to resolve problems and install new equipment
    ▪ Customer service, Technical service
  • CEA-Leti MINATEC / CNRS / LTM, Grenoble, FRANCE - Stagiaire Master 2

    2012 - 2012 Subject: A process for copying stamps transparencies for NIL (Nanoimprint Lithography). Development and characterization of die stamp manufacturing in transparent organic materials with low hardness. The final objective is the realization of a quartz stamp whose active area is obtained by replication of hard master stamp in a suitable organic material.

    o Analytical characterization of two solutions transparent organic material (Homogeneity : Profilometer; Photocrosslinking : analysing kinetic using FTIR; Mechanical properties : hardness and elastic modulus using Nanoindentation)

    o Developing stamps for prototype equipment NIL. (Deposit metal using Electron Beam Evaporation; Study transparency using UV Spectroscopy; Photolithography MJB4, Optic & Confocal Microscopy).

    o Copying the master pattern and imprint onto stamps in prototype equipment NIL and looked patterns using SEM (Scanning Electron Microscopy).
  • Univerisity of Strasbourg - Electronics Projects : Design PCB Electronics

    2011 - 2011 2011 University of Strasbourg
    Electronics projects

    • Drone project: « A control circuit design for synchronous electric motors. » Power control and digital control (PIC16F877, ICD3 link, and assembler).

    o Project initiation
    o Electronics development phase (Hardware, software, CAD PCB layout…)
    o Integration, Verification & Validation (IVV)
  • University of Strasbourg - Ingénieur Conception ASICs Mixtes

    Strasbourg 2009 - 2010 2009 – 2012 Master Sc: University of Strasbourg

    Using professional software tool "CADENCE" in a project in AMS 0.35μm CMOS technology system. Mixed design flows (analog - digital) in AMS 0.35μm CMOS technology.

    1st Project: Design of an A / D converter to acquire basic skills in mixed-signal IC design. Realization of 4-bit ADC. (3 months)

    2d Project: Design an integrated system for measuring magnetic fields.(3 months)

    o Set-up of CAD systems and analogue & digital design flows.
    o Introduction of design methodologies top-down; bottom-up.
    o Initialise analogue design flow.
    o Initialise digital design flow, VHDL-AMS; Verilog.
    o Layout
    o Full chip simulation, including parasitics, part behaviour level.
    o Place and route SoC
    o Verification DRC - LVS - RCX
  • CEA-Leti MINATEC / CNRS / LTM, Grenoble, FRANCE - Stage Licence Professionnelle

    2009 - 2009 2009 Research Assistant (Internship, 6 months) 2/2009 – 7/2009
    CEA - LETI / LTM, Grenoble, FRANCE

    Subject: Study of the degradation of the antiadhesion stamps treatment used in the NIL (NanoImprint Lithography).

    o Analysis of physico-chemical properties of 2 anti-adhesive molecules applied on the surface of a mold or stamp used in nanoimprint NIL.

    o Analysing the degradation of anti-adhesive properties depending on the number of prints with various characterization tools (Surface energy using Contact angle; Thickness using Ellipsometry).

    Publication co-authored by me
  • I.M.E.P. / L.A.H.C. MINATEC, Grenoble, FRANCE - Stage DUT

    2008 - 2008 2008 R.F. Electronics (Internship, 3 months)
    I.M.E.P. / L.A.H.C. / MINATEC, Grenoble, FRANCE

    Designed different types of Ultra Broadband bandpass filters (RadioFrequency) using ADS Agilent EDA.
    o Design of bandpass filters.
    o Optimization of design and full simulation, including parasitics.
    o Design and miniaturization of bandpass filters layout.
    o Fabrication and measurement of filters using vector network analyser.
  • University of Joseph Fourier, Grenoble - Electronics Projects : Design Electronics PCB

    2008 - 2008 • « Radio controlled car with on-board Camera » (Transmitter RF Receiver – VHF transmitter – PIC18F886 Programming in C).
    • « A white line follower robot » (Power control - Digital signal processing – FPGA XILINX XC9536PC44-15 Programming in VHDL).

    o Project initiation
    o Electronics development phase (Hardware, software, CAD PCB layout…)
    o Integration, Verification & Validation (IVV)

Formations

  • University Of Strasbourg (Strasbourg)

    Strasbourg 2009 - 2012 MASTER of Science

    MASTER of Science in Microelectronics & Nanoelectronics. - Fundamentals of Microelectronics: Digital and analog architectures, basic physics components and compact models, integrated technology and MEMS; Implementation of CAD tools.
    Economics and project management, quality management and human resources.
    Physical modeling and technology bases, characterization of materials and components, compo
  • Joseph Fourier, University Of Grenoble, FRANCE

    Grenoble 2008 - 2009 Licence Professionnelle Electricité ElectroniqueBACHELOR of Science in Electrical and Electronics specializing in Microelectronics and Microsystem

    Electrical and Electronics specializing in Microelectronics and Microsystem
  • Joseph Fourier, University Of Grenoble, FRANCE

    Grenoble 2006 - 2008 Two-year degree university in technology of Electrical and Industiral Engineering, specializing in Electronics

    Electrical and Industiral Engineering, specializing in Electronics
  • Lycée Pablo Neruda

    St Martin D'Heres 2003 - 2005 STI Electrotechnique

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