Over 14 years’ experience in semiconductor's manufacturing, design and engineering with good technical skills in WLP (Wafer Level Packaging): Photolithography, Bonding, Dry Etching, Laser drilling, Metal deposition, WLO & WLC processes given me an excellent interpersonal, management and leadership skills. I am able to take responsibility and lead a wide range of projects with full accountability. My strengths lie in strategy, improving efficiency of operations and relationship-building.
Mes compétences :
Gestion de projet