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Continental
- SENIOR PROJECT MANAGER for DAIMLER/RENAULT EMS3160 Engine Management Unit R&D R&D 2M€ et CA 130M€
Toulouse
2016 - maintenant
In POWER TRAIN Department development of Gasoline Driver Injector GDI for 4 and 3 cylinder applications
First SOP Renault in June 2017 in Foix Plant
Up to 1,3M units per year
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Continental
- SENIOR PROJECT MANAGER for DAIMLER/RENAULT EMS3160 Engine Management Unit R&D R&D 2M€ et CA 130M€
Toulouse
2016 - maintenant
In POWER TRAIN Department development of Gasoline Driver Injector GDI for 4 and 3 cylinder applications
First SOP Renault in June 2017 in Foix Plant
Up to 1,3M units per year
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Continental
- PROJECT MANAGER for RENAULT (LED DRIVER)
Toulouse
2013 - 2016
Exterior Light Control Units LED DRIVER for CMF1 platform used on HEADLAMP with DRL, HB and LB functions with R&D 5M€ et CA 80M€
I manage 22 engineers in Vienna and Iasi
First SOP Renault in June 2014
Up to 1.5 M units per year
The project cover 11 cars developments with Hella (Slovenia, China), Valeo (Angers,China), AMS, Automotives Lighting,
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Continental
- PROJECT MANAGER for RENAULT (LED DRIVER)
Toulouse
2013 - 2016
Exterior Light Control Units LED DRIVER for CMF1 platform used on HEADLAMP with DRL, HB and LB functions with R&D 5M€ et CA 80M€
I manage 22 engineers in Vienna and Iasi
First SOP Renault in June 2014
Up to 1.5 M units per year
The project cover 11 cars developments with Hella (Slovenia, China), Valeo (Angers,China), AMS, Automotives Lighting,
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CONTINENTAL AUTOMOTIVES
- SYSTEM PROJECT MANAGER for RENAULT (CMF1) R&D 7.5M€ et CA 340M€
Toulouse
2010 - 2015
The system, as committed by Continental towards RENAULT, is a complete development set that includes:
System components (BCM, CID, DHM, Kazashi/Antennas, WPC, ETA)
BCM and PASE functions
The System Project Manager takes in charge the definition, integration and verification of a set of system functions (PASE, BCM control functions) distributed among a defined set of above System components.
I manage 44 people with 6 Project Leader,
- Access PASE or conventional key
- First SOP Renault in June 2014
- Up to 1.5 M units per year
- The project cover 11 cars developments in 5 Renault plants (France, Korea, Turkie, Spain, UK)
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CONTINENTAL AUTOMOTIVES
- PROJECT MANAGER for RENAULT (X90 = LOGANE) R&D 2.5M€ and CA 38M€
2008 - 2010
I was in charge of BCM Interior product for RENAULT – DACIA, the development locations was Toulouse, Timisoara and Tunisia, the production location was at CIPI in Tunisia.
I manage 27 people: HW, SW, Mechanical, Quality, Process engineer pilots.
Redesign of current series BCM, introducing lead
- Microcontroller, Smart drivers, Optimizing Electromechanical relays allocation
- Replacing components to handle possible obsolescence risks
- New PCB design / new test equipments
- Software porting and SW re-development for Immobilizer, RF and Hazard lamps management
- 1st project LEAD FREE for Interior
- BCM X90 manufacturing concept reflow, wave soldering process and lead free
- Development of new manufacturing test equipments (ICT bed of nails, ICT program, EOL test program, RF test program)
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SIEMENS AUTOMOTIVES
- SYSTEM PROJECT MANAGER for RENAULT (L38 Korea SAMSUNG) R&D 3.5M€ and CA 27M€
2006 - 2008
Apply for R&D and tracking of the R&D regarding costs, time-schedule and technical requirements
Guarantee that P0409F is respected
Organize and manage meetings according to P04902f (Kick-off, Design, Layout, Test and Quality)
Follow up the development schedule with supplier and internal customer
Ensure that each deviation from agreed issues is made in agreement with supplier and internal customer
Distribute working documents to internal customers and supplier as well as update the central disc and internet-page on a regular basis
Official interface for communication to internal customer and the supplier
Tracking of technical requirements
Redesign decision based on delay, cost, performance
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SIEMENS AUTOMOTIVES
- SYSTEM PROJECT MANAGER PASE-ACCESS for RENAULT (Laguna) and NISSAN (L42/L53)
2004 - 2006
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SIEMENS AUTOMOTIVES
- PROJECT LEADER ASIC from 1998 to 2004
1998 - 2004
1.ATIC35 design with ST microelectronic (Munich+Agrate)
2.ATIC49 – Digital ASIC commands for H-Bridges design with MELEXIS (Belgium)
3. ATIC50 – Tire pressure sensor avec interface RF design with SENSONOR/NORDIC/STM (Norway/France)
4. ATM38EMI/36N/43 Quad power stage design with ST MICROELECTRONIC (Munich+Agrate)
5. ATIC59 – Multi function voltage regulator (5V, 2.6/3V), magnetic pickup and Kline transceiver design with MOTOROLA (Toulouse)
6. ATIC61 – H-Bridge driver design with ATMEL (Heilborn)
7. ATIC71 – Ignition driver & diagnostic IC design with TEXAS INSTRUMENTS (Dallas)
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SIEMENS AUTOMOTIVES
- IC DESIGNER ASIC from 1995 to 2004
1995 - 1998
1. ATIC 08 (High Side Driver) ATIC 10 (microcontroller) and ATIC 13 (low cost microcontroller) for ISU AT25
2. ATM39 – Octal low side driver design with ST MICROELECTRONIC (Munich+Agrate)
3. ATM39light – Octal low side driver version light design with ST MICROELECTRONIC (Munich+Agrate)
IC DESIGNER
Obtain the integration concept and the behavior models
Write and approve the IC specification
Adapt the IC specification to the requirements of our customer and the possibilities of the available technologies (what must be done vs. what can be done)
Check the performance of IC's vs. specification and customer requirements
Preferred solution for integration, errata sheet release, identify design errors
Collect failure conditions for reproduction in supplier laboratories
Help IC project leader in the prediction of project drifts
Propose integrated solutions fitted to problems of Business field
Technical support of the BF on the introduction of the IC into the application
Technical feasibility evaluation of the supplier
Validity of technical information provided by the supplier
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TEXAS INSTRUMENTS
- Application engineer for microcontroller
Villeneuve-Loubet
1995 - 1995
Test of the applications for automobile customer, build the test board and the tools (simulator) for the microcontroller TMS370/C8 and TMS370/C16.
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FARNELL ELECTRONIC
- Field application engineer
1994 - 1995
Design, support the sales engineer for technical aspects, hardware and software on the following family of microcontroller MICROCHIP (PIC16C/17C), SGS-THOMSON (ST6, ST9, ST10), and TOSHIBA (TLCS-47, TLCS-870, TLCS-Z80, TLCS 900/9000, 68HC05/11, TLCS 68000) and the memory EPROM, EEPROM.