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Insight SiP
- Senior Sales Manager
Wattignies
2014 - 2019
Responsible for growing revenue of Insight SiP with Design Service solutions to address
customer system in package requirements. Focus on Business Development in Europe, North America and Asia regions.
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Altis Semiconductor
- Senior Marketing Manager
2011 - 2014
Senior Marketing Manager in the Worldwide Sales&Marketing department in charge of developing Altis Semiconductor open foundry solutions to address specific market: Smart Secure and RF/Telecom. This implies:
- increase customer reach in security market segments especially in Europe and Asia targeting RFID tags, NFC and e-ID
products (focus on contactless devices, non volatile memory, and site security certification TUVIT/ISO27001)
- driving technology roadmap to address customer needs, ranging from 180nm to 90/65nm nodes ;
- having close cooperation with R&D and Design Center to establish complete ecosystem, integrating IP/EDA vendors
and 3rd party Design House partners
- performing market intelligence studies to support new process/technology developments ;
- analyzing business cases and ROIs for different platforms (eg High Voltage, Non Volatile Memory, RF-SOI) ;
- winning new customer on a worldwide basis though roadshows, seminars, conferences (already 20 customers won) ;
- managing marketing and product presentations (eg Altis Corporate and Smart Secure materials)
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TSMC Europe
- Account Manager
2011 - 2011
Part of the Sales-Marketing organization of several European customers for automotive, consumer, smartcard or MEMs applications with following responsibilities:
- understand customer needs, roadmaps and promote TSMC Value Solutions in close collaboration with R&D ;
- ensure platform solution readiness (fab, technology, IP) with FAE team. ;
- secure fab capacity with 3-year roll-out plan with Customer Service team ;
- drive project feasibility/study (thru phase-in or TSMC technology) by putting in place legal documents, SOW,
business case and commercial solution.
- interface with customer at VP Operations, Purchasing/Technical Director levels
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TSMC Europe
- Senior Technical Manager
2008 - 2011
In charge of the Field Technical Support team and Deputy of the Technical Director. This involved
- providing pre tape-out support to European customers covering design flows, technology/IP selection, pre-sales workshops and trainings. Strong cooperation with TSMC Account Management/Business Development team and with customer management (CTO, PMO, Marketing) to define/align product requirements. Process nodes currently being used are CMOS logic 65/40/28/20nm for Wireless, Femtocell, Setup-Box, Automotive, MEMS applications ;
- managing the relationship with EDA/IP providers and ASIC Design Houses ;
- coordinating technical support of TSMC distributor (eg IMEC) to address emerging customers or growth accounts: priority alignment, collaborative model establishment, methodology guidance. ;
- managing the FTS/FAE team (8 people) during the Technical Director's absence: reporting to Executive Management, working on hiring procedure, defining the training plan, alignment on technical issues
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Texas Instruments France
- Program Manager
Villeneuve-Loubet
2004 - 2008
Program Manager in the European Wireless Terminal Business Unit on several projects for digital wireless applications (Bluetooth, GSM, Edge, WCDMA).This involved coordinating all the activities (ASIC design, test engineering, layout, planning, qualification, packaging) from development, prototyping to production with a strong customer interface who is a major Northern European Key Players in the mobile communication. Key Responsibilities:
WCDMA/HSDPA/HSUPA targeted for medium-end phones using TI latest 45nm technology. This device was the TI silicon process driver and required close cooperation with TI Silicon R&D, IP providers, Quality and Product Engineering teams. Design complexity: 26Mgates, 16MBit SRAM, ARM1176, TI DSP, RFCODEC, Video Codec, flip-chip POP package.
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Texas Instruments France
- Program Manager
Villeneuve-Loubet
1995 - 2004
Program Manager in the European Wireless Terminal Business Unit on several projects for digital wireless applications (Bluetooth, GSM, Edge, WCDMA).This involved coordinating all the activities (ASIC design, test engineering, layout, planning, qualification, packaging) from development, prototyping to production with a strong customer interface who is a major Northern European Key Players in the mobile communication. Key Responsibilities:
3 Digital Basebands for GSM/EDGE/Bluetooth applications using TI 180-110nm technologies in different packages (wire-bond, flip-chip). Devices have been released to production.
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Texas Instruments Ltd.
- ASIC Application Engineer
1993 - 1995
As an ASIC Application Engineer I offered design support and training to several key customers (Middle-East and Africa region, eg 3-month assignment in Israel) in the following fields: front-end RTL (Verilog/VHDL synthesis) and design hand-off.
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Silicon Microsystems Ltd.
- Senior Design Engineer
1991 - 1993
As a Senior Design Engineer I was involved in several DTI research programs for Behavioural Synthesis of VLSI systems. Three complex digital ASICs were designed with experience gained in HDLs (ELLA, MODEL), Logic Simulator, Auto-placement/route and layout generations.
