ASIC and SiP project management, with strong hardware background.
Mes compétences :
Gestion de projet
Electronique
Entreprises
keecker
- Hardware design manager
PARIS 102015 - maintenant
Parrot
- Hardware Engineer
PARIS2015 - 2015
Parrot
- OEM Project manager
PARIS2014 - 2014Responsible for the industrialization and certification of a high end OEM module.
Parrot
- ASIC project manager
PARIS2011 - 2014§ Responsible for a 0.18µm PMIC dedicated to a 40nm Soc.
Full specification, IP selection, management of several subcontractors (analog an digital design team, integration and back-end team) and internal ressources (package, test and qualification).
§ Responsible for several 'System In Package' chips. Problematic of space reduction, cost and testability.
Skills : chip specification, package, analog IPs, integration problematics, project management, Test, qualification (Package, AECQ100, ESD, Latch-up).
Parrot
- Ingénieur Hardware
PARIS2005 - 20112009-2011 : Hardware & ASIC package platform engineer
Specification and validation of the padring and package of Parrot's ASICs
Skills : BGA design, POP packages, drop and vibrations tests, Daisy chain packages, ASICs padring (in-pad ESD protection and SSO).
2007-2009 : Hardware platform engineer
Responsible of the validation and characterization of Parrot's new ASIC : Development board specification and design, temperature and corner validation of the ASICs, generation of reference design, support for the product teams. Parrot's ASICs are mixed type (digital and analog), with ARM CPU, GPU, Audio, USB and eventually integrated PMIC.
Skills : DDR RAM signal integrity, USB qualification, Audio and power supplies.
2005-2007 : Hardware designer for audio consumer products.
Components sourcing, architecture and schematics, validation, qualification (CEM, ESD, Drop tests, ...) and industrialisation in Asia of four products : Parrot Sound system, Parrot Boombox, Parrot DS3120 and Parrot Party.
Skills : audio, bluetooth, power management, battery management, USB, layout.
CEA Grenoble
- Ingénieur de Recherche
2002 - 2004En contrat de qualification, j'ai été chargé pendant deux ans du dévelloppement en salle blanche de techniques lithographiques sur une résine épaisse.
Ces recherches ont aboutis à deux brevets permettant de réaliser des motifs à flans inclinés et à épaisseur variable dans une résine épaisse nommée SU-8, à application dans le domaine des microsystèmes (MEMs), et plus particulièrement en microfluidique.
