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Patrick DOS SANTOS

Velizy Villacoublay

En résumé

I possess a unique combination of software and design skills in the co-design of SiP (System In Package) and globally IC/Package/Board system co-design and analysis.

Solution Architect for SIP and Sr Pre-sale engineer, i am consultant for the major SiP and Packaging European customer projects working on leading edge technologies. I have strong analysis capabilities in the system process optimization, interconnects and related RF and high speed signal transmission, power distribution networks,EMC/EMI, Thermal simulations and DFM for packaging.
My experience in both electronic design and analysis (as well as programming) provides the ability to effectively deal with the complex problems encountered in RF/Digital system architecture.

Specialties:
- Consulting, High end technology and service solutions
- Solid technical background in SiP (System in Package) co-design within the IC RF/Digital, IC Packaging, process optimization, Signal Integrity, EMC/EMI, Thermal analysis, DFM
- Project Manager
- Development of applications for process optimization.
Tools: All the Cadence Allegro Platform (APD/ SiP ...), 3D EM FS Optimal PakSI, Virtuoso (Composer / Layout), Encounter, EDI.

Mes compétences :
Architect
Consulting
Manager
optimization
Process
Process Optimization
SIP
Solution Architect

Entreprises

  • Cadence Design Systems - Sr Sales Technical Leader

    Velizy Villacoublay maintenant

Formations

Pas de formation renseignée

Réseau

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