Mes compétences :
High tech
Intégration
Microwave
Radar
Remote sensing
Researcher
Semiconductor
Sensors
Télécommunication
Télécommunications
Wireless
Entreprises
AS+ / IPDiA
- R&D Engineer, RF/Analog Designer
2011 - maintenantIPDiA has developed PICS (Passive Integration Connecting Substrate) as well as 3D packaging and Interconnection. We are involved in Silicon based 3D-IPD (Integrated Passive Device) advanced technology.
This very flexible technology is using front-end IC processing techniques to integrate passive components. It allows us to integrate from 10’s to 100’s of passive components such as resistors, capacitors, inductors and diodes in a single Silicon die. Moreover, based on this core technology, we are proposing complete packaging designs and operations for SiP solutions.
The main advantages of our technology are higher miniaturization, wider operating temperature range (from -55°C up to 250°C), very low leakage currents (reducing consumptions), high characteristics stability versus temperature or voltage variations, high reliability and low influence of ageing.
Our mission is to propose to our customers and to end users solutions to miniaturize their applications while keeping a very high standard of performance, both on the technological and the economical aspects. IPDiA will focus its efforts on the particular field of Integrated Passive Devices, its core competence.
LAAS-CNRS
- R&D Engineer
2009 - 2011- Heterogeneous Integration of Communicating Nano-Objects on Flexible Substrate (3-5 Ghz, 60 Ghz)
- Development of Passive Micro-Sensors (based on EM transduction principle)
- Wieless Interrogation Techniques (Based on FMCW Radar)
Skills:
_ Patent on Remote Electromagnetic Pressure Measurmeent using FMCW Radar
_ EM Simulation Tools: Feko, ADS, Sonnet, IE3D, HFSS, CST.
_ Microwave Measurement Techniques
_ Clean Room Working Ability
_ Multiphysic Simulation Tools: COMSOL Multiphysics
_ More Tools: Matlab, Mapple, Clewin, Max+, Ansoft Designer, Circuit Maker
LAAS-CNRS
- PhD-Student
2005 - 2009Ph.D (Microwave Electromagnetism and Optelectronic)
Thesis subject: Passive Micro-Sensors Based on Electromagnetic Transduction Principle for Remote pressure sensing
Skills:
_ Microwave circuit design, fabrication and measurement.
_ Electromagnetic Transduction based Micro-Sensor design. fabrication and measurement.
_ Micro-Sensors fabrication in Clean Room.
_ On Wafer combined (Pressure & RF) measurement.
_ Electromagnetic Sensor modeling.
_ Dielectric material characterisation.
_ 39 publications in International journals, Conferences & National seminars.
ENSEEIHT
- Master's degree student in Microwave Electromagnetism and Optoelectronic
2004 - 2005_ Design of Radio Frequency Microsystems (30 GHz Planar Resonator) (HFSS).
_ Development of Radio Frequency Microsystems for Pressure Measurement
_ Development of Radio Frequency based Solutions for Complex Permittivity extraction
Tunisie Telecom_TUNIPAC _ National Center for Data Transmission (Souse, Tunisia).
- Development Engineer (Trainee)
2003 - 2003_ Comparative Study of Different Data Transmission Protocols (X25, Frame Relay, ATM)
TUNISAIR _ (Tunisian Air Company) _ AIMHB (Habib Bourguiba Monastir International Airport)
- Engineer (Trainee)
2002 - 2002_ Study and Optimization of the (AIMHB) Local Area Network
ENIT (National Engineering School of Tunis) / Tunis El Manar University
- Student
2001 - 2004_ End of studies project: Design, Fabrication and Measurement of Planar Multiband Antenna (1Ghz – 3Ghz)
